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CC2640R2FYFVT.B Scheda tecnica(PDF) 49 Page - Texas Instruments

Il numero della parte CC2640R2FYFVT.B
Spiegazioni elettronici  CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU
PDF  74 Pages
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Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
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CC2640R2FYFVT.B Scheda tecnica(HTML) 49 Page - Texas Instruments

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11 Device and Documentation Support
11.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all pre-production part numbers
or date-code markings. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for
example, CC2640R2F is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
null Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, ).
For orderable part numbers of the CC2640R2F device RSM, RHB, RGZ, or YFV package types, see the
Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales
representative.
SimpleLink™ Multistandard
Wireless MCU
DEVICE FAMILY
PREFIX
X = Experimental device
Blank = Qualified device
PACKAGE DESIGNATOR
RGZ = 48-pin VQFN (Very Thin Quad Flatpack No-Lead)
RHB = 32-pin VQFN (Very Thin Quad Flatpack No-Lead)
RSM = 32-pin VQFN (Very Thin Quad Flatpack No-Lead)
YFV = 34-pin DSBGA (Die-Size Ball Grid Array)
R = Large Reel
T = Small Reel
CC26 xx
zzz
(R/T)
yyy
ROM version
F128 = ROM version 1
R2F = ROM version 2
DEVICE
40 = Bluetooth
Figure 11-1. Device Nomenclature
www.ti.com
CC2640R2F
SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020
Copyright © 2020 Texas Instruments Incorporated
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Product Folder Links: CC2640R2F



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