CC2640R2FYFVT.B datasheet(10/74 Pages) TI2

10 / 74 page

Table 7-1. Signal Descriptions – RGZ Package (continued)

NAME

NO.

TYPE

DESCRIPTION

VDDS

Power

1.8-V to 3.8-V main chip supply(1)

VDDS2

Power

1.8-V to 3.8-V DIO supply(1)

VDDS3

Power

1.8-V to 3.8-V DIO supply(1)

VDDS_DCDC

Power

1.8-V to 3.8-V DC/DC supply

X32K_Q1

Analog I/O

32-kHz crystal oscillator pin 1

X32K_Q2

Analog I/O

32-kHz crystal oscillator pin 2

X24M_N

Analog I/O

24-MHz crystal oscillator pin 1

X24M_P

Analog I/O

24-MHz crystal oscillator pin 2

EGP

Power

Ground – Exposed Ground Pad

(1)

For more details, see the technical reference manual (listed in Section 11.3).

(2)

Do not supply external circuitry from this pin.

(3)

For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™

Wireless MCU Technical Reference Manual

(4)

If internal DC/DC is not used, this pin is supplied internally from the main LDO.

(5)

If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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