LMKDB1104FS85 datasheet(12/69 Pages) TI2

12 / 69 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDDx

Supply voltage on any VDD pin

–0.3

3.63

VIN

Input voltage on CLKIN and digital input pins

–0.3

3.63

IOUT

Output current - continuous (CLKOUT)

Output current - continuous (SMB_DATA, SBI_OUT)

Output current - surge (CLKOUT)

Output current - surge (SMB_DATA, SBI_OUT)

Storage temperature

–65

150

℃

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001 (1)

±2000

Charged-device model (CDM), per ANSI/ESDA/

JEDEC JS-002 (2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Junction temperature

125

°C

Ambient temperature

–40

105

°C

VDD

Power supply voltage

2.97

3.3

3.6

1.71

1.8

1.89

VIN

Input voltage on CLKIN and digital input pins

–0.3

3.6

tramp

Power ramping time

0.05

6.4 Thermal Information

PACKAGE

PINS

THERMAL METRIC(1)

UNIT

RθJA

RθJC(top)

RθJB

ΨJT

ΨJB

RθJC(bot)

RSL0048 (VQFN)

32.2

22.3

14.3

0.5

14.2

6.1

°C/W

REX0028 (VQFN)

44.2

36.8

20.6

0.9

20.6

5.9

°C/W

REY0020 (VQFN)

46.4

50.4

20.3

1.1

20.3

6.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

LMKDB1202, LMKDB1204, LMKDB1208

SNAS927A – AUGUST 2025 – REVISED APRIL 2026

www.ti.com

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Product Folder Links: LMKDB1202 LMKDB1204 LMKDB1208

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