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H8S/2218 Scheda tecnica(PDF) 50 Page - Renesas Technology Corp |
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H8S/2218 Scheda tecnica(HTML) 50 Page - Renesas Technology Corp |
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50 / 750 page ![]() Section 1 Overview Rev.6.00 Jun. 03, 2008 Page 2 of 698 REJ09B0074-0600 H8S/2212 Group ROM Part No. ROM RAM Remarks Flash memory Version HD64F2212 128 kbytes 12 kbytes SCI boot mode HD64F2212U 128 kbytes 12 kbytes USB boot mode HD64F2211 64 kbytes 8 kbytes SCI boot mode HD64F2211U 64 kbytes 8 kbytes USB boot mode Masked ROM Version HD6432211 64 kbytes 8 kbytes ⎯ HD6432210 32 kbytes 4 kbytes ⎯ HD6432210S 32 kbytes 4 kbytes ⎯ • General I/O ports I/O pins: 69 for the H8S/2218 Group, 37 for the H8S/2212 Group • Supports various power-down states • Compact package Package Code* Body Size Pin Pitch Remarks TQFP-100 TFP-100G, TFP-100GV 12.0 × 12.0 mm 0.4 mm H8S/2218 Group P-LFBGA-112 BP-112, BP-112V 10.0 × 10.0 mm 0.8 mm LQFP-64 FP-64E, FP-64EV 10.0 × 10.0 mm 0.5 mm H8S/2212 Group VQFN-64 TNP-64B, TNP-64BV 8.0 × 8.0 mm 0.4 mm Note: * A V appended to the end of the package code indicates a lead-free version. |
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