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AM1808AZCED3 Scheda tecnica(PDF) 113 Page - Texas Instruments

Il numero della parte AM1808AZCED3
Spiegazioni elettronici  AM1808 ARM Microprocessor
PDF  264 Pages
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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AM1808AZCED3 Scheda tecnica(HTML) 113 Page - Texas Instruments

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DDR2/mDDR
Device
RegionshouldencompassallDDR2/mDDRcircuitryandvaries
dependingonplacement.Non-DDR2/mDDRsignalsshouldnotbe
routedontheDDRsignallayerswithintheDDR2/mDDRkeepout
region.Non-DDR2/mDDRsignalsmayberoutedintheregion
providedtheyareroutedonlayersseparatedfromDDR2/mDDR
signallayersbyagroundlayer.Nobreaksshouldbeallowedinthe
referencegroundlayersinthisregion.Inaddition,the1.8Vpower
planeshouldcovertheentirekeepoutregion.
AM1808
www.ti.com
SPRS653A – FEBRUARY 2010 – REVISED APRIL 2010
6.11.3.5 DDR2/mDDR Keep Out Region
The region of the PCB used for the DDR2/mDDR circuitry must be isolated from other signals. The
DDR2/mDDR keep out region is defined for this purpose and is shown in Figure 6-19. The size of this
region varies with the placement and DDR routing. Additional clearances required for the keep out region
are shown in Table 6-28.
Figure 6-19. DDR2/mDDR Keepout Region
Copyright © 2010, Texas Instruments Incorporated
Peripheral Information and Electrical Specifications
113
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