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TMS570LS Scheda tecnica(PDF) 67 Page - Texas Instruments

Il numero della parte TMS570LS
Spiegazioni elettronici  Series 16/32-BIT RISC Flash Microcontroller
PDF  107 Pages
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TMS570LS Scheda tecnica(HTML) 67 Page - Texas Instruments

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Wirebond Voiding Fail Mode
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Continuous Junction Temperature (°C)
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TMS570LS20206-EP, TMS570LS20216-EP
www.ti.com
SPNS209A – JUNE 2012 – REVISED AUGUST 2012
(1)
See the absolute maximum ratings and the recommended operating conditions.
(2)
Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).
(3)
The predicted operating lifetime vs junction temperature is based on reliability modeling using electromigration as the dominant
failure mechanism affecting device wearout for the specific device process and design characteristics.
Figure 6-1. TMS570LS20206-EP and TMS570LS20216-EP Operating Life Derating Chart
Figure 6-2. TMS570LS20206-EP and TMS570LS20216-EP Wirebond Voiding Fail Mode
Copyright © 2012, Texas Instruments Incorporated
Device Electrical Specifications
67
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Product Folder Link(s): TMS570LS20206-EP TMS570LS20216-EP



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