TMS570LS datasheet(7/107 Pages) TI1

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TMS570LS20206-EP, TMS570LS20216-EP

www.ti.com

SPNS209A – JUNE 2012 – REVISED AUGUST 2012

TMS570LS Series 16/32-BIT RISC Flash

Device Registers

....................................... 58

Microcontroller

.......................................... 1

5.1

Device Identification Code Register

................ 58

1.1

Features

............................................. 1

5.2

Die-ID Registers

.................................... 60

1.2

SUPPORTS DEFENSE AND AEROSPACE

5.3

PLL Registers

...................................... 61

APPLICATIONS

..................................... 2

Device Electrical Specifications

.................... 62

1.3

Description

........................................... 3

6.1

Operating Conditions

............................... 62

1.4

ORDERING INFORMATION

........................ 5

6.2

Absolute Maximum Ratings Over Operating Free-

1.5

Functional Block Diagram

........................... 6

Air Temperature Range (unless otherwise noted)

. 62

Device Overview

........................................ 8

6.3

Device Recommended Operating Conditions

...... 62

2.1

Terms and Acronyms

................................ 8

6.4

Thermal Information

................................ 63

2.2

Device Characteristics

............................... 9

6.5

Electrical Characteristics Over Operating Free-Air

Temperature Range

................................ 64

2.3

Memory

............................................. 10

Peripheral and Electrical Specifications

.......... 68

2.4

Pin Assignments

.................................... 18

7.1

Clocks

.............................................. 68

2.5

Terminal Functions

................................. 23

7.2

ECLK Specification

................................. 72

2.6

Device Support

..................................... 36

7.3

RST And PORRST Timings

........................ 73

Reset / Abort Sources

................................ 38

7.4

TEST Pin Timing

................................... 75

3.1

Reset / Abort Sources

.............................. 38

7.5

DAP - JTAG Scan Interface Timing

................ 76

Peripherals

.............................................. 41

7.6

Output Timings

..................................... 77

4.1

Error Signaling Module (ESM)

..................... 41

7.7

Input Timings

....................................... 78

4.2

Direct Memory Access (DMA)

...................... 44

7.8

Flash Timings

...................................... 79

4.3

High End Timer Transfer Unit (HET-TU)

........... 45

7.9

SPI Master Mode Timing Parameters

.............. 80

4.4

Vectored Interrupt Manager (VIM)

................. 46

7.10

SPI Slave Mode Timing Parameters

............... 84

4.5

MIBADC Event Trigger Sources

................... 48

7.11

CAN Controller Mode Timings

...................... 88

4.6

MIBSPI

.............................................. 49

7.12

SCI/LIN Mode Timings

............................. 88

4.7

ETM

................................................ 51

7.13

FlexRay Controller Mode Timings

.................. 88

4.8

Debug Scan Chains

................................ 52

7.14

EMIF Timings

....................................... 89

4.9

CCM

................................................ 53

7.15

ETM Timings

....................................... 91

4.10

LPM

................................................. 54

7.16

RTP Timings

........................................ 93

4.11

Voltage Monitor

..................................... 54

7.17

DMM Timings

....................................... 95

4.12

CRC

................................................ 54

7.18

MibADC

............................................. 96

4.13

System Module Access

............................ 54

Mechanical Packaging and Orderable

4.14

Debug ROM

........................................ 55

Information

............................................ 102

4.15

CPU Self Test Controller: STC / LBIST

............ 56

8.1

Packaging Information

............................ 102

Contents

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