ADIN1101CCPZ-R7 datasheet(6/79 Pages) AD

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Data Sheet

ADIN1101

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 6 of 79

TA = 25°C, unless otherwise noted.

Table 5. Absolute Maximum Ratings

Parameter

Rating

VDDIO to GND

−0.3 V to +4 V

DVDD_1P1, DLDO_1P1 to GND

−0.3 V to +1.35 V

AVDD_H, AVDD_L to GND

−0.3 V to +4 V

MAC Interface1, MDIO, MDC, INT to GND

−0.3 V to VDDIO + 0.3 V

TXN, TXP to GND

−0.3 V to AVDD + 0.3 V

LED_0, RESET, LINK_ST/PHYAD_2 to GND −0.3 V to VDDIO + 0.3 V

XTAL_I/CLK_IN to GND

−0.3 V to +2.75 V

XTAL_O, CLK25_REF to GND

−0.3 V to +1.35 V

Temperature

Operating Range (TA), Industrial

−40°C to +105°C

Storage Range

−65°C to +150°C

Junction (TJ max)

125°C

Power Dissipation

(TJ max − TA)/θJA

Lead Temperature

JEDEC industry standard

Soldering

J-STD-020

1 See the Pin Configuration and Function Descriptions section for the full list of

MAC interface pins.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Table 6. Thermal Resistance

Package Type

θJA1

θJC

Unit

CP-32-202

°C/W

1 θJA is specified for the worst case conditions, that is, a device soldered in a

circuit board for surface-mount packages.

2 Test Condition 1: thermal impedance simulated values are based on a JE-

DEC 2S2P thermal test board with thermal vias. See JEDEC JESD-51.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for ADIN1101

Table 7. ADIN1101, 32-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

TXP, TXN Pins

8000

All Other Pins

2000

FICDM

1250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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