ADMV1455BBCZ-R7 datasheet(86/141 Pages) AD

86 / 141 page

Data Sheet

ADMV1455

APPLICATIONS INFORMATION

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Rev. 0 | 86 of 141

RECOMMENDED PCB LAYOUT

The ADMV1455 package type is a ball grid array that allows for

a high pin count in a small footprint. The exposed balls on the

underside of the package are intended to be soldered to a low

thermal and electrical impedance ground plane. Typically, the PCB

contains a solder mask defined land pattern for each ball to ensure

proper solder containment and attachment.

Care must be taken with the RF trace routing escape plan for a par-

ticular implementation. In order of precedence, it is recommended

to prioritize the RF traces, followed by the power supply pins, and

then the digital logic connections.

The RF connections into and out of the ADMV1455 are near the

edge of the package to ease the escape plan. Inner layer trace

stripline routing is encouraged, particularly for applications where

RF isolation performance metrics are important. Regardless of

the type of RF traces employed in a PCB design, it is generally

recommended to have via stitching run parallel to either side of the

RF traces. The via stitching can be either through-board type vias

or blind layer-to-layer vias.

Ideally, the ground connection balls are connected to the through-

board type vias to maximum the heat transfer from the package to

the PCB thermal plane. Refer to the Thermal Resistance section for

more information on ADMV1455 thermal performance metrics.

The ADMV1455 evaluation board utilizes the recommendations

listed within this section, and this section is a good starting point for

many applications. Refer to the ADMV1455-EVALZ user guide for

more information regarding the evaluation board.

EVALUATION BOARD INFORMATION

See the ADMV1455-EVALZ evaluation board web page for addi-

tional information on the evaluation board for the ADMV1455.

ADMV1455BBCZ-R7 Scheda tecnica(PDF) 86 Page - Analog Devices