LMKDB1104FS datasheet(113/133 Pages) TI2

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13.2 Package Option Addendum

Packaging Information

Orderable

Device

Status(1)

Package type

Package

Drawing

Pins

Package Qty

Eco Plan(2)

Lead finish/

Ball

material(6)

MSL Peak

Temp(3)

Op Temp (°C)

Device

marking(4) (5)

SNDB1104Z85

REXR

PRE_PROD

VQFN

REX

2500

RoHS & Green

NIPDAU

Level-1-260C-

168 HR

-40 to 105

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using

this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please

check www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS

requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where

designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the

die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free

(RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based

flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will

appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device

Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.

Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that

it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to

the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis

on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other

limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold

by TI to Customer on an annual basis.

www.ti.com

LMKDB1102, LMKDB1104, LMKDB1104FS, LMKDB1108, LMKDB1108FS

LMKDB1112, LMKDB1120, LMKDB1120FS

SNAS855G – NOVEMBER 2023 – REVISED MAY 2026

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Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS

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