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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LMKDB1104FS Scheda tecnica(PDF) 131 Page - Texas Instruments |
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LMKDB1104FS Scheda tecnica(HTML) 131 Page - Texas Instruments |
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131 / 133 page  www.ti.com EXAMPLE BOARD LAYOUT 24X (0.4) (1.05) (1.05) (R0.05) TYP 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 28X (0.6) 28X (0.2) (3.8) (3.8) ( 2.6) ( 0.2) TYP VIA VQFN - 1 mm max height REX0028A PLASTIC QUAD FLATPACK - NO LEAD 4229744/B 07/2025 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SEE SOLDER MASK DETAIL 1 7 8 14 15 21 22 28 29 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS |
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