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LMKDB1108FS Scheda tecnica(PDF) 102 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 102 Page - Texas Instruments |
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102 / 133 page ![]() 10.4 Layout 10.4.1 Layout Guidelines Use a low-inductance ground connection between the device DAP and the PCB. Match PCB trace impedance with device output impedance (85Ω or 100Ω differential impedance). Eliminate stubs and reduce discontinuity on the transmission lines. 10.4.2 Layout Example Figure 10-6. LMKDB1120 and LMKDB1120FS Layout Example - Top Layer Figure 10-7. LMKDB1120 and LMKDB1120FS Layout Example - Bottom Layer Figure 10-8. LMKDB1108 and LMKDB1108FS Layout Example - Top Layer Figure 10-9. LMKDB1108 and LMKDB1108FS Layout Example - Bottom Layer Figure 10-10. LMKDB1104 and LMKDB1104FS Layout Example - Top Layer Figure 10-11. LMKDB1104 and LMKDB1104FS Layout Example - Bottom Layer LMKDB1102, LMKDB1104, LMKDB1104FS, LMKDB1108, LMKDB1108FS LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855G – NOVEMBER 2023 – REVISED MAY 2026 www.ti.com 102 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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