LMKDB1108FS datasheet(104/133 Pages) TI2

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11 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, LMKDB1120 Evaluation Module, user's guide

• Texas Instruments, LMKDB1108 Evaluation Module, user's guide

• Texas Instruments, LMKDB1104 Evaluation Module, user's guide

• Texas Instruments, LMKDB1204 Evaluation Module, user's guide

• Texas Instruments, LMKDB1102/1202 Evaluation Module, user's guide

• Texas Instruments, Timing is Everything: How to measure additive jitter, blog post

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

11.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (November 2025) to Revision G (May 2026)

Page

• Updated to include LMKDB1113 register map and package information........................................................... 1

• Updated LMKDB1104 OE pin behavior to internal pull-up................................................................................. 4

Changes from Revision E (August 2025) to Revision F (November 2025)

Page

• Updated to include LMKDB1112 register map....................................................................................................1

• Deleted preview information from LMKDB1112 rows in the Device Comparison table...................................... 3

LMKDB1102, LMKDB1104, LMKDB1104FS, LMKDB1108, LMKDB1108FS

LMKDB1112, LMKDB1120, LMKDB1120FS

SNAS855G – NOVEMBER 2023 – REVISED MAY 2026

www.ti.com

104

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Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS

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