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LMKDB1108FS Scheda tecnica(PDF) 107 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 107 Page - Texas Instruments |
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107 / 133 page ![]() 13.1 Mechanical Data www.ti.com PACKAGE OUTLINE 6.1 5.9 6.1 5.9 1.0 0.8 0.05 0.00 2X 4.4 44X 0.4 2X 4.4 48X 0.5 0.3 4.2 0.1 48X 0.25 0.15 (0.2) TYP VQFN - 1 mm max height RSL0048G PLASTIC QUAD FLATPACK - NO LEAD 4231403/A 12/2024 0.08 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.3) SYMM EXPOSED THERMAL PAD SYMM 1 12 13 24 25 36 37 48 49 0.1 C A B 0.05 C SCALE 2.300 A B C www.ti.com LMKDB1102, LMKDB1104, LMKDB1104FS, LMKDB1108, LMKDB1108FS LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855G – NOVEMBER 2023 – REVISED MAY 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 107 Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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