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ORSPI4 Scheda tecnica(PDF) 20 Page - Lattice Semiconductor

Il numero della parte ORSPI4
Spiegazioni elettronici  Dual SPI4 Interface and High-Speed SERDES FPSC
PDF  263 Pages
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Produttore elettronici  LATTICE [Lattice Semiconductor]
Homepage  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ORSPI4 Scheda tecnica(HTML) 20 Page - Lattice Semiconductor

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Lattice Semiconductor
ORCA ORSPI4 Data Sheet
20
– 1—256 x 36 (dual-port, one read/one write).
– 1—1K x 9 (dual-port, one read/one write).
– 2—512 x 9 (dual-port, one read/one write for each).
– 2 RAMS with an arbitrary number of words whose sum is 512 (or less) x 18 (dual-port, one read/one write).
– Supports joining of RAM blocks.
– Two 16 x 8-bit content addressable memory (CAM) support.
– FIFO 512 x 18, 256 x 36, 1K x 9, or dual 512 x 9.
– Constant multiply (8 x 16 or 16 x 8).
– Dual variable multiply (8 x 8).
• Embedded 32-bit internal system bus plus 4-bit parity interconnects FPGA logic, MicroProcessor interface (MPI),
embedded RAM blocks, and embedded standard cell blocks with 100 MHz bus performance. Included are built-
in system registers that act as the control and status center for the device.
• Built-in testability:
– Full boundary scan (
IEEE 1149.1 and Draft 1149.2 JTAG).
– Programming and readback through boundary scan port compliant to
IEEE Draft 1532:D1.7.
– TS_ALL testability function to 3-state all I/O pins.
– New temperature-sensing diode.
• Improved built-in clock management with Programmable Phase-Locked Loops (PPLLs) provide optimum clock
modification and conditioning for phase, frequency, and duty cycle from 20 MHz up to 420 MHz. Multiplication of
the input frequency up to 64x and division of the input frequency down to 1/64x possible.
• New cycle stealing capability allows a typical 15% to 40% internal speed improvement after final place and route.
This feature also enables compliance with many setup/hold and clock to out I/O specifications and may provide
reduced ground bounce for output buses by allowing flexible delays of switching output buffers.
Programmable Logic System Features
• PCI local bus compliant for FPGA I/Os.
• Improved
PowerPC
® 860 and PowerPC II high-speed synchronous microprocessor interface can be used for
configuration, readback, device control, and device status, as well as for a general-purpose interface to the
FPGA logic, RAMs, and embedded standard cell blocks. Glueless interface to synchronous
PowerPC processors
with user-configurable address space provided.
• New embedded
AMBA specification 2.0 AHB system bus (ARM
® processor) facilitates communication among
the microprocessor interface, configuration logic, Embedded Block RAM, FPGA logic, and embedded standard
cell blocks.
• Variable size bused readback of configuration data capability with the built-in microprocessor interface and sys-
tem bus.
• Internal, 3-state, and bidirectional buses with simple control provided by the SLIC.
• New clock routing structures for global and local clocking significantly increases speed and reduces skew (<200
ps for OR4E04).
• New local clock routing structures allow creation of localized clock trees.
• Two new edge clock routing structures allow up to six high-speed clocks on each edge of the device for improved
setup/hold and clock to out performance.
• New Double-Data Rate (DDR) and Zero-Bus Turn-around (ZBT) memory interfaces support the latest high-
speed memory interfaces.
• New 2x/4x uplink and downlink I/O capabilities interface high-speed external I/Os to reduced speed internal
logic.
• Meets Universal Test and Operations PHY Interface for ATM (UTOPIA) levels 1, 2, and 3; as well as POS-PHY3.



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