IMX53IEC datasheet(1/173 Pages) FREESCALE

Il numero della parte	IMX53IEC

Spiegazioni elettronici	i.MX53 Applications Processors for Industrial Products

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Produttore elettronici	FREESCALE [Freescale Semiconductor, Inc]

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX53IEC

Rev. 6, 03/2013

MCIMX53xC

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 2

1

Introduction

The i.MX53 processor features ARM Cortex™-A8

core, which operates at clock speeds as high as

800 MHz. It provides DDR2/LVDDR2-800,

LPDDR2-800, or DDR3-800 DRAM memories.

The flexibility of the i.MX53 architecture allows for its

use in a wide variety of applications. As the heart of the

application chipset, the i.MX53 processor provides all

the interfaces for connecting peripherals, such as

WLAN, Bluetooth™, GPS, hard drive, camera sensors,

and dual displays.

Features of the i.MX53 processor include the following:

•

Applications processor—The i.MX53xD

processors boost the capabilities of high-tier

portable applications by satisfying the ever

increasing MIPS needs of operating systems and

games. Freescale’s Dynamic Voltage and

Frequency Scaling (DVFS) provides significant

power reduction, allowing the device to run at

lower voltage and frequency with sufficient

MIPS for tasks such as audio decode.

i.MX53 Applications

Processors for Industrial

Products

Silicon Version 2.1

1.

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Functional Part Differences and Ordering

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2.

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2.

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1.

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1.

Special Signal Considerations . . . . . . . . . . . . . . . 16

4.

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1.

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16

4.2.

Power Supply Requirements and Restrictions . . . 23

4.3.

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26

4.4.

Output Buffer Impedance Characteristics . . . . . . 32

4.5.

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36

4.6.

System Modules Timing . . . . . . . . . . . . . . . . . . . . 43

4.7.

External Peripheral Interfaces Parameters . . . . . . 65

4.8.

XTAL Electrical Specifications . . . . . . . . . . . . . . 141

5.

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142

5.1.

Boot Mode Configuration Pins . . . . . . . . . . . . . . 142

5.2.

Boot Devices Interfaces Allocation . . . . . . . . . . . 143

5.3.

Power Setup During Boot . . . . . . . . . . . . . . . . . . 144

6.

Package Information and Contact Assignments . . . . . 145

6.1.

19x19 mm Package Information . . . . . . . . . . . . . 145

7.

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

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