IMX53IEC datasheet(17/173 Pages) FREESCALE

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Electrical Characteristics

i.MX53 Applications Processors for Industrial Products, Rev. 6

Freescale Semiconductor

4.1.2

Thermal Resistance

4.1.2.1

TEPBGA-2 Package Thermal Resistance

Table 5 provides the TEPBGA-2 package thermal resistance data.

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN

-0.3

3.631

Input/Output Voltage Range

Vin/Vout

-0.5

OVDD +0.32

ESD Damage Immunity:

Vesd

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage Temperature Range

TSTORAGE

-40

150

1 USB_DN and USB_DP can tolerate 5 V for up to 24 hours.

2 The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 111 on page 148. The maximum range can be superseded by the DC tables.

Table 5. TEPBGA-2 Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

RθJA

°C/W

Junction to Ambient (natural convection)1, 2, 3

3 Per JEDEC JESD51-6 with the board horizontal.

Four layer board

(2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board

(1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Four layer board

(2s2p)

RθJMA

°C/W

Junction to Board4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—RθJB

6°C/W

Junction to Case5

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—RθJC

4°C/W

Junction to Package Top (natural convection)6

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

—

ΨJT

4°C/W

Table 4. Absolute Maximum Ratings (continued)

Parameter Description

Symbol

Min

Max

Unit

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