GD25S513MDFEG datasheet(5/94 Pages) GIGADEVICE

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3.3V Uniform Sector

Dual and Quad Serial Flash

GD25S513MD

GENERAL DESCRIPTION

The GD25S513MD (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory is based on the popular GD25B

series by stacking two individual GD25B257D dies into a standard 8-pin package. It offers the highest memory density

for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for applications that demand

high Program/Erase data throughput.

The GD25S513MD Serial flash supports the standard Serial Peripheral Interface (SPI), and the Dual/Quad SPI:

Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO), I/O2, and I/O3. The Dual SPI data is transferred with speed of

208Mbit/s, the Quad SPI data is transferred with speed of 416Mbit/s, and the DTR Quad I/O data is transferred with speed

of 640Mbits/s.

CONNECTION DIAGRAM

Figure 1 Connection Diagram

Note:

Only for special order, Pin 3 of 16-LEAD SOP package or Pin A4 of 24-BALL TFBGA (5x5 ball array) package is

RESET# pin. Please contact GigaDevice for detail.

CS# must be driven high if chip is not selected. Please don’t leave CS# floating any time after power is on.

CS#

(IO1)

IO2

VSS

Top View

VCC

IO3

SCLK

(IO0)

8–LEAD WSON

Top View

ECS#

IO3

IO2

VCC

(1)

SI(IO0)

DQS

VSS

SO(IO1)

CS#

SCLK

24-BALL TFBGA (5x5 ball array)

CS#

(IO1)

IO2

VSS

Top View

VCC

IO3

SCLK

(IO0)

16-LEAD SOP

(1)

DQS

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