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GD25S513MDFEG Scheda tecnica(PDF) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

Il numero della parte GD25S513MDFEG
Spiegazioni elettronici  3.3V Uniform Sector Dual and Quad Serial Flash
PDF  94 Pages
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Produttore elettronici  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Homepage  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25S513MDFEG Scheda tecnica(HTML) 7 Page - GigaDevice Semiconductor (Beijing) Inc.

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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25S513MD
7
Serial MCP Device Configuration
Figure 2 GD25S513MD Device configuration
Die 1#
GD25B257D
Die 0#
GD25B257D
GD25S513MD
CS#
SCLK
RESET#
(1)
IO0
IO1
IO2
IO3
DQS
ECS#
Note: 1. RESET# pin is available on SOP16 and TFBGA packages
All signal pins are shared by the stacked dies within the package. Each die is assigned a “Die ID#” in the factory. Only
a single die is active at any given time, and have the control of SPI bus to communicate with the external SPI controller.
However, all the dies will accept two instructions regardless their Active or Idle status: a) “Software Die Select (C2H)”
instruction: it is used to set any single die to be active according to the 8-bit Die ID following the instruction. b
) “Software
Reset (66H+99H)” instruction: it is used to reset all the stacked dies to the power-up state.



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