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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LMKDB1104FS Scheda tecnica(PDF) 124 Page - Texas Instruments |
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LMKDB1104FS Scheda tecnica(HTML) 124 Page - Texas Instruments |
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124 / 133 page  www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND 20X (0.2) 20X (0.6) ( 0.2) TYP VIA 16X (0.4) (2.8) (2.8) (0.6) ( 1.7) (R0.05) TYP (0.6) VQFN - 1 mm max height REY0020B PLASTIC QUAD FLATPACK - NO LEAD 4229745/A 06/2023 SYMM 1 5 6 10 11 15 16 20 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 21 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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