FS23 datasheet(17/230 Pages) NXP

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NXP Semiconductors

FS23

Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers

10 Thermal characteristics

Symbol

Description (Rating)

Min

Max

Unit

Thermal ratings

Ambient temperature (Grade 1)

–40

125

°C

Junction temperature (Grade 1)

–40

150

°C

TSTG

Storage temperature

–55

150

°C

Thermal resistance (per JEDEC JESD51-2 and JESD51-8)

RθJA[1]

Thermal resistance junction to ambient (2s2p)

28.5

°C/W

RθJC_BOT[2]

Thermal resistance junction to case bottom

(between the die and the solder pad on the bottom of the package)

2.3

°C/W

RθJC_TOP[3]

Thermal resistance junction to case top

(between package top and the junction temperature)

19.1

°C/W

ΨJT[1]

Thermal characterization parameter Junction to Top of package

0.3

°C/W

Table 7. Thermal characteristics

[1]

Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal

performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an

application-specific environment.

[2]

Junction-to-Case Bottom thermal resistance determined using an isothermal cold plate. Case temperature refers to the exposed pad surface temperature

at the package bottom side dead center.

[3]

Junction-to-Case Top thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold surface temperature at the

package top side dead center.

FS23

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7.0 — 16 October 2024

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