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LMKDB1108FS Scheda tecnica(PDF) 19 Page - Texas Instruments

Il numero della parte LMKDB1108FS
Spiegazioni elettronici  LMKDB11xx PCIe Gen 1 to Gen 7 Ultra Low Jitter LP-HCSL Clock Buffer Family
PDF  126 Pages
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Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
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LMKDB1108FS Scheda tecnica(HTML) 19 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VDDx
Supply voltage on any VDD pin
–0.3
3.63
V
VIN
Input voltage on CLKIN and digital input pins
–0.3
3.63
V
IOUT
Output current - continuous (CLKOUT)
30
mA
Output current - continuous (SMB_DATA, SBI_OUT)
25
mA
Output current - surge (CLKOUT)
60
mA
Output current - surge (SMB_DATA, SBI_OUT)
50
mA
TS
Storage temperature
–65
150
℃
(1)
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001 (1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/
JEDEC JS-002 (2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TJ
Junction temperature
125
°C
TA
Ambient temperature
–40
105
°C
VDD
Power supply voltage
2.97
3.3
3.6
V
1.71
1.8
1.89
V
VIN
Input voltage on CLKIN and digital input pins
–0.3
3.6
V
tramp
Power ramping time
0.05
5
ms
6.4 Thermal Information
PACKAGE
PINS
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
ΨJB
RθJC(bot)
NPP0080 (TLGA)
80
33.1
31.9
16.2
0.5
16.0
1.8
°C/W
ZSF0064 (LGA)
64
65.0
31.4
42.5
0.8
42.4
N/A
°C/W
RKP0040 (VQFN)
40
33.6
24.6
13.8
0.4
13.7
4.2
°C/W
REX0028 (VQFN)
28
44.2
36.8
20.6
0.9
20.6
5.9
°C/W
REY0020 (VQFN)
20
46.4
50.4
20.3
1.1
20.3
6.5
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
note.
www.ti.com
LMKDB1102, LMKDB1104, LMKDB1104FS
LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS
SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025
Copyright © 2025 Texas Instruments Incorporated
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Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS



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