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LMKDB1108FS Scheda tecnica(PDF) 19 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 19 Page - Texas Instruments |
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19 / 126 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDDx Supply voltage on any VDD pin –0.3 3.63 V VIN Input voltage on CLKIN and digital input pins –0.3 3.63 V IOUT Output current - continuous (CLKOUT) 30 mA Output current - continuous (SMB_DATA, SBI_OUT) 25 mA Output current - surge (CLKOUT) 60 mA Output current - surge (SMB_DATA, SBI_OUT) 50 mA TS Storage temperature –65 150 ℃ (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001 (1) ±2000 V Charged-device model (CDM), per ANSI/ESDA/ JEDEC JS-002 (2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TJ Junction temperature 125 °C TA Ambient temperature –40 105 °C VDD Power supply voltage 2.97 3.3 3.6 V 1.71 1.8 1.89 V VIN Input voltage on CLKIN and digital input pins –0.3 3.6 V tramp Power ramping time 0.05 5 ms 6.4 Thermal Information PACKAGE PINS THERMAL METRIC(1) UNIT RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot) NPP0080 (TLGA) 80 33.1 31.9 16.2 0.5 16.0 1.8 °C/W ZSF0064 (LGA) 64 65.0 31.4 42.5 0.8 42.4 N/A °C/W RKP0040 (VQFN) 40 33.6 24.6 13.8 0.4 13.7 4.2 °C/W REX0028 (VQFN) 28 44.2 36.8 20.6 0.9 20.6 5.9 °C/W REY0020 (VQFN) 20 46.4 50.4 20.3 1.1 20.3 6.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. www.ti.com LMKDB1102, LMKDB1104, LMKDB1104FS LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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