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H8S/2224 Scheda tecnica(PDF) 1015 Page - Renesas Technology Corp |
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H8S/2224 Scheda tecnica(HTML) 1015 Page - Renesas Technology Corp |
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1015 / 1071 page ![]() Section 27 Electrical Characteristics Rev. 5.00 Aug 08, 2006 page 929 of 982 REJ09B0054-0500 Item Symbol Min Typ Max Unit Test Conditions RES 1.0 µA Input leakage current STBY, NMI, FWE, MD2 to MD0 1.0 µA Vin = 0.5 to VCC – 0.5 V* 3 Vin = 0.2 to VCC – 0.2 V* 4 Ports 4, 9 | Iin | 1.0 µA Vin = 0.5 to AVCC – 0.5 V* 3 Vin = 0.2 to AVCC – 0.2 V* 4 Three states leakage current (off) Ports 1, 3, 7, and A to G | ITSI | 1.0 µA Vin = 0.5 to VCC – 0.5 V* 3 Vin = 0.2 to VCC – 0.2 V* 4 Input pull-up MOS current Ports A to E –IP 10 300 µA Vin = 0V Notes: 1. If the A/D or D/A converter is not used, the AVCC, Vref, and AVSS pins should not be open. Even if the A/D or D/A converter is not used, connect the AVCC and Vref pins to VCC and supply 2.0 V to 3.6 V. In this case, Vref ≤ AVCC. 2. VCC = 2.7 V to 3.6 V 3. For ZTAT version and masked ROM version 4. For F-ZTAT version |
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