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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LMKDB1108FS Scheda tecnica(PDF) 120 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 120 Page - Texas Instruments |
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120 / 126 page  NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4219083/A 03/2021 www.ti.com VQFN - 1 mm max height PLASTIC QUAD FLATPACK- NO LEAD RKP0040B A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM PIN 1 INDEX AREA 5.1 4.9 5.1 4.9 0.05 0.00 1 MAX SEATING PLANE C (0.1) TYP 3.6 3.4 36X 0.4 4X 3.6 PIN1 ID (OPTIONAL) 40X 0.5 0.3 40X 0.25 0.15 1 10 11 20 21 30 31 40 41 |
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