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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LMKDB1108FS Scheda tecnica(PDF) 121 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 121 Page - Texas Instruments |
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121 / 126 page  NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4219083/A 03/2021 www.ti.com VQFN - 1 mm max height RKP0040B PLASTIC QUAD FLATPACK- NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SOLDER MASK DETAILS NON- SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND METAL SOLDERMASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL ( 3.5) 2X (4.8) 2X (4.8) 36X (0.4) 40X (0.6) 40X (0.2) 2X (0.6) 2X (0.9) 2X (0.6) 2X (0.9283) (Ø 0.2) VIA TYP (R 0.05) TYP 1 10 11 20 21 30 31 40 |
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