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H8S/2224 Scheda tecnica(PDF) 965 Page - Renesas Technology Corp

Il numero della parte H8S/2224
Spiegazioni elettronici  16-Bit Single-Chip Microcomputer H8S Family/H8S/2200 Series
PDF  1071 Pages
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Produttore elettronici  RENESAS [Renesas Technology Corp]
Homepage  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

H8S/2224 Scheda tecnica(HTML) 965 Page - Renesas Technology Corp

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Section 27 Electrical Characteristics
Rev. 5.00 Aug 08, 2006 page 879 of 982
REJ09B0054-0500
(4) DMAC Timing
Table 27.20 lists the DMAC timing.
Table 27.20 DMAC Timing
Condition A (F-ZTAT version and masked ROM version):
VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V,
Vref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 to 16.0 MHz,
Ta = –20°C to +75°C (regular specifications)
Condition B (Masked ROM version): VCC = 2.2 V to 3.6 V, AVCC = 2.2 V to 3.6 V,
Vref = 2.2 V to AVCC, VSS = AVSS = 0 V, φ = 2 to 6.25 MHz,
Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition C (F-ZTAT version and masked ROM version):
VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V,
Vref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 10.0 MHz to
20.0 MHz, Ta = 20°C to +75°C (regular specifications),
Ta = 40°C to +85°C (wide-range specifications)
Condition A
Condition B
Condition C
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test Conditions
DREQ setup time
tDRQS
40
60
30
ns
DREQ hold time
tDRQH
10
20
10
ns
Figure 27.23
TEND delay time
tTED
30
50
30
ns
Figure 27.22
DACK delay time 1
tDACD1
30
50
30
ns
Figure 27.20
DACK delay time 2
tDACD2
30
50
30
ns
Figure 27.21



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