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H8S/2214 Scheda tecnica(PDF) 718 Page - Renesas Technology Corp |
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H8S/2214 Scheda tecnica(HTML) 718 Page - Renesas Technology Corp |
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718 / 936 page ![]() Section 18 Electrical Characteristics Rev.4.00 Sep. 18, 2008 Page 658 of 872 REJ09B0189-0400 18.6 Flash Memory Characteristics Table 18.12 lists the flash memory characteristics. Table 18.12 Flash Memory Characteristics Conditions: V CC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = AVCC, VSS = AVSS = 0 V, V CC = 3.0 V to 3.6 V(program/erase operating voltage range), T a = -20°C to +75°C (program/erase operating temperature range) Item Symbol Min. Typ. Max. Unit Test Conditions Programming time* 1 *2 *4 t P — 40 200 ms/128 bytes Erase time* 1 *3 *5 t E — 20 1000 ms/block Rewrite time N WEC 100* 6 10000* 7 — Times Data retention time t DRP *8 10 — — Years Programming Wait time after SWE1 bit setting* 1 t sswe 1 1 — µs Wait time after PSU1 bit setting* 1 t spsu 50 50 — µs Wait time after P1 bit setting* 1 *4 t sp10 8 10 12 µs t sp30 28 30 32 µs 1 ≤ n ≤ 6 t sp200 198 200 202 µs 7 ≤ n ≤ 1000 Wait time after P1 bit clearing* 1 t cp 5 5 — µs Wait time after PSU1 bit clearing* 1 t cpsu 5 5 — µs Wait time after PV1 bit setting* 1 t spv 4 4 — µs Wait time after H'FF dummy write* 1 t spvr 2 2 — µs Wait time after PV1 bit clearing* 1 t cpv 2 2 — µs Wait time after SWE1 bit clearing* 1 t cswe 100 100 — µs Maximum number of writes* 1 *4 N1 — — 6* 4 Times N2 — — 994* 4 Times Erasing Wait time after SWE1 bit setting* 1 t sswe 1 1 — µs Wait time after ESU1 bit setting* 1 t sesu 100 100 — µs Wait time after E1 bit setting* 1 *5 t se 10 10 100 ms Wait time after E1 bit clearing* 1 t ce 10 10 — µs Wait time after ESU1 bit clearing* 1 t cesu 10 10 — µs Wait time after EV1 bit setting* 1 t sev 20 20 — µs Wait time after H'FF dummy write* 1 t sevr 2 2 — µs Wait time after EV1 bit clearing* 1 t sev 4 4 — µs Wait time after SWE1 bit clearing* 1 t cswe 100 100 — µs Maximum number of erases* 1 *5 N — — 100 Times Notes: 1. Follow the program/erase algorithms when making the time settings. |
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