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LMKDB1108FS Scheda tecnica(PDF) 102 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 102 Page - Texas Instruments |
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102 / 126 page ![]() www.ti.com PACKAGE OUTLINE 4.1 3.9 4.1 3.9 1.0 0.8 0.05 0.00 2X 2.4 24X 0.4 2X 2.4 28X 0.5 0.3 2.6 0.1 28X 0.25 0.15 (0.1) TYP VQFN - 1 mm max height REX0028A PLASTIC QUAD FLATPACK - NO LEAD 4229744/A 06/2023 0.08 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.3) SYMM EXPOSED THERMAL PAD SYMM 1 7 8 14 15 21 22 28 29 0.1 C A B 0.05 C SCALE 3.000 A B C LMKDB1102, LMKDB1104, LMKDB1104FS LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025 www.ti.com 102 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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