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LMKDB1108FS Scheda tecnica(PDF) 104 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 104 Page - Texas Instruments |
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104 / 126 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 28X (0.6) 28X (0.2) 24X (0.4) (3.8) (3.8) (0.675) TYP (0.675) TYP 4X (1.15) 4X (1.15) (R0.05) TYP VQFN - 1 mm max height REX0028A PLASTIC QUAD FLATPACK - NO LEAD 4229744/A 06/2023 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.1 MM THICK STENCIL SCALE: 20X EXPOSED PAD 29 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 1 7 8 14 15 21 22 28 29 LMKDB1102, LMKDB1104, LMKDB1104FS LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025 www.ti.com 104 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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