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LMKDB1108FS Scheda tecnica(PDF) 105 Page - Texas Instruments |
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LMKDB1108FS Scheda tecnica(HTML) 105 Page - Texas Instruments |
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105 / 126 page ![]() www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 20X 0.25 0.15 1.7 0.05 20X 0.5 0.3 1.0 0.8 (DIM A) TYP OPT 02 SHOWN 0.05 0.00 16X 0.4 4X 1.6 A 3.1 2.9 B 3.1 2.9 0.25 0.15 0.5 0.3 VQFN - 1 mm max height REY0020B PLASTIC QUAD FLATPACK - NO LEAD 4229745/A 06/2023 OPTION 01 (0.1) DIMENSION A OPTION 02 (0.2) PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 5 11 15 6 10 20 16 X0.3) (45 PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD 21 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 4.000 DETAIL OPTIONAL TERMINAL TYPICAL www.ti.com LMKDB1102, LMKDB1104, LMKDB1104FS LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 105 Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS |
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