LMKDB1108FS datasheet(103/126 Pages) TI2

103 / 126 page

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EXAMPLE BOARD LAYOUT

24X (0.4)

(1.05)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

28X (0.6)

28X (0.2)

(3.8)

(

2.6)

( 0.2) TYP

VIA

VQFN - 1 mm max height

REX0028A

PLASTIC QUAD FLATPACK - NO LEAD

4229744/A 06/2023

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

SEE SOLDER MASK

DETAIL

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS

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LMKDB1102, LMKDB1104, LMKDB1104FS

LMKDB1108, LMKDB1108FS, LMKDB1112, LMKDB1120, LMKDB1120FS

SNAS855F – NOVEMBER 2023 – REVISED NOVEMBER 2025

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Product Folder Links: LMKDB1102 LMKDB1104 LMKDB1104FS LMKDB1108 LMKDB1108FS LMKDB1112 LMKDB1120 LMKDB1120FS

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