AM186EM-33VCSLASHW datasheet(54/98 Pages) AMD

54 / 98 page

Am186/188EM and Am186/188EMLV Microcontrollers

PRELIMINA R Y

THERMAL CHARACTERISTICS

TQFP Package

The Am186EM and Am188EM microcontrollers are

specified for operation with case temperature ranges

from 0

°C to +100°C for a commercial temperature de-

vice. Case temperature is measured at the top center

of the package as shown in Figure 15. The various tem-

peratures and thermal resistances can be determined

using the equations in Figure 16 with information given

in Table 8.

JA is the sum of θJC and θCA. θJC is the internal ther-

mal resistance of the assembly.

CA is the case to am-

bient thermal resistance.

The variable P is power in watts. Typical power

supply current (ICC) for the Am186EM and Am188EM

microcontrollers is 5.9 mA per MHz of clock frequency.

Figure 15.

Thermal Resistance(

°C/Watt)

Figure 16.

Thermal Characteristics Equations

Table 8.

Thermal Characteristics (

°C/Watt)

JA = θJC + θCA

Package/Board

Airflow

(Linear Feet

per Minute)

PQFP/2-Layer

0 fpm

200 fpm

400 fpm

600 fpm

TQFP/2-Layer

0 fpm

200 fpm

400 fpm

600 fpm

PQFP/4-Layer

to 6-Layer

0 fpm

200 fpm

400 fpm

600 fpm

TQFP/4-Layer

to 6-Layer

0 fpm

200 fpm

400 fpm

600 fpm

JA = θJC + θCA

P=5.9 mA

⋅ freq (MHz) ⋅V

TJ=TC+( P⋅θJC )

TJ=TA+ (P

⋅θ

JA )

TC=TJ–( P

⋅θ

JC )

TC=TA+( P⋅θCA )

TA=TJ–( P⋅θJA )

TA=TC–( P⋅θCA )

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