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F4MP Scheda tecnica(PDF) 23 Page - NXP Semiconductors |
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F4MP Scheda tecnica(HTML) 23 Page - NXP Semiconductors |
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23 / 37 page ![]() PTN3355 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 3.1 — 4 November 2016 23 of 37 NXP Semiconductors PTN3355 Low power DP to VGA adapter with integrated 1 : 2 VGA switch 13.6 DAC 13.7 HSYNC, VSYNC characteristics [1] The parameter values specified are simulated and absolute values. 13.8 Configuration pins CFG5, DOCK_IN, TESTMODE Table 19. DAC characteristics Over operating free-air temperature range, unless otherwise noted. Symbol Parameter Conditions Min Typ Max Unit Nres(DAC) DAC resolution - - 8 bit fclk clock frequency - - 240 MHz I o(DAC) DAC output current variation DAC-to-DAC - - 4 % INL integral non-linearity 1 0.25 +1 LSB DNL differential non-linearity 0.5 0.1 +0.5 LSB Vo(DAC)max maximum DAC output voltage 665 700 770 mV Co(DAC) DAC output capacitance - 3.5 - pF DAC noise injection ratio 1.5 - +1.5 % Table 20. HSYNC and VSYNC characteristics Over operating free-air temperature range, unless otherwise noted. Symbol Parameter Conditions Min Typ Max Unit Output characteristics VOH HIGH-level output voltage IOH =8mA; VDD(3V3) =3.3 V 10 % 2.4 - - V VOL LOW-level output voltage IOL = 8mA - - 0.5 V IOSH HIGH-level short-circuit output current drive HIGH; cell connected to ground [1] -- 100 mA IOSL LOW-level short-circuit output current drive LOW; cell connected to VDD [1] -- 100 mA Table 21. Configuration pins characteristics Over operating free-air temperature range, unless otherwise noted. Symbol Parameter Conditions Min Typ Max Unit Input characteristics VIH HIGH-level input voltage 0.7 V DD(3V3) -- V VIL LOW-level input voltage 0.3 V DD(3V3) V Weak pull-down characteristics Ipd pull-down current VI =VDD(3V3) 15 30 70 A Ipu pull-up current VI =0V 25 55 90 A Rext external resistance external resistor used on configuration pins -- 10 k |
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