F4MP datasheet(29/37 Pages) NXP

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PTN3355

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Product data sheet

Rev. 3.1 — 4 November 2016

29 of 37

NXP Semiconductors

PTN3355

Low power DP to VGA adapter with integrated 1 : 2 VGA switch

15.5 Barcode label

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Fig 14. Box and reel information barcode

Table 26.

Barcode dimensions

Box barcode label

 w (mm)

Reel barcode label

 w (mm)

100

 75

100

 75

001aak714

NXP SEMICONDUCTORS

MADE IN >COUNTRY<

[PRODUCT INFO]

(33T) PUID: B.0987654321

(30T) LOT2

(30D) DATE2

(30Q) QTY2

(31D) REDATE

(32T) ORIG

(31T) PMC

(31P) MSL/PBT

MSL/PBT

Optional product information*

Fixed text

Country of origin

i.e. "Made in....." or

"Diffused in EU [+]

Assembled in......

Packing unit (PQ) identification

2nd traceability lot number*

Traceability lot number

Date code

With linear barcode

Type number

NXP 12NC

Quantity

2nd (youngest) date code*

2nd Quantity*

Re-approval date code*

Origin code

Product Manufacturing Code

MSL at the Peak Body solder

temperature with tin/lead*

MSL at the higher lead-free

Peak Body Temperature*

2D matrix with all data

(including the data identifiers)

Additional info if halogen

free product

Additional info on RoHS

Lead-free symbol

HALOGEN FREE

RoHS compliant

(1T) LOT

(9D) DATE

(Q) QTY

(30P) TYPE

(1P) CODENO

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