R34DS0017EU0104 Rev.1.04

Page 38

Jan 31, 2025

ISL73041SEH Datasheet

10. Ordering Information

11. Revision History

Part Number[1]

1. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with

both SnPb and Pb-free soldering operations.

Radiation Hardness

(Total Ionizing Dose)

Package Description

(RoHS Compliant)

Package

Drawing

Carrier

Type

Temp Range

ISL73041SEHML

LDR to 75krad(Si)

16 Pad CLCC Packaged

Device (QML-V Level

Screening)

J16.A

Tray

-55 to +125°C

ISL73041SEHMX[2]

2. Die product tested at TA = + 25°C. The wafer probe test includes functional and parametric testing sufficient to make the die capable of

meeting the electrical performance outlined in Electrical Specifications. The die is sourced from wafer lots that have been qualified for

Group C and Group E per MIL-PRF-38535 (Refer to R34TB0001: Renesas Radiation Hardened QML-V Equivalent Screening and QCI

Flow for more information).

Bare Die (QML-V Level

Screening)

N/A

N/A

ISL73041SEHX/SAMPLE[2][3]

3. The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity. These parts

are intended for engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature

specified in this datasheet. The /SAMPLE parts are capable of meeting the electrical limits and conditions specified in this datasheet. The

/SAMPLE parts do not receive 100% screening across temperature to the electrical limits. These part types do not come with a Certificate

of Conformance.

N/A

Die

N/A

N/A

ISL73041SEHL/PROTO[3]

16 Pad CLCC Packaged

Device

J16.A

Tray

ISL73041SEHEV1Z[4]

4. Evaluation board uses the /PROTO parts and /PROTO parts are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect

(SEE) immunity.

ISL73041SEH Evaluation Board

ISL73847SEHEV2Z[4]

ISL73847SEH + ISL73041SEH Evaluation Board

ISL73847SEHDEMO2Z[4]

ISL73847SEH + ISL73041SEH Business Card Size Demonstration board with Package GaN

FETs; VIN = 12V; VOUT = 1V; IOUT = 50A; fSW = 500kHz;

Rev.

Date

Description

1.04

Jan 31, 2025

Updated the PGND and SGND pin descriptions.

Added SGND to PGND parameter spec to Abs max section.

Updated the Layout Guidelines section.

1.03

Jan 4, 2024

Updated Features bullets.

Added Dual Complimentary Low-Side GaN FET Driver section.

1.02

Jun 22, 2023

Updated Figure 14.

Updated Ordering Information table.