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ISL73847SEHDEMO2Z Scheda tecnica(PDF) 11 Page - Renesas Technology Corp

Il numero della parte ISL73847SEHDEMO2Z
Spiegazioni elettronici  Radiation Hardened 12V Half-Bridge GaN FET Driver
PDF  40 Pages
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Produttore elettronici  RENESAS [Renesas Technology Corp]
Homepage  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL73847SEHDEMO2Z Scheda tecnica(HTML) 11 Page - Renesas Technology Corp

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R34DS0017EU0104 Rev.1.04
Page 11
Jan 31, 2025
ISL73041SEH Datasheet
UGL Output Low Voltage
VOLUGL
ISINK = 100mA; Voltage above PHS
-55 to
+125°C
50
80
mV
UGL Gate Discharge
Resistor
RUGL
EN = 0
800
1000
1400
Ω
Lower Gate Low Output (LGL)
LGL Peak Sink Current
ILGLSNK
VDD = 4.75V; FB = PVCC;
BOOT-PHS = 4.5V;
PWM = 5V; 1µF load on LG-PGND
--
8
-
A
LGL Output Low Voltage
VOLLGL
ISINK = 100mA;
Voltage above GND
-55 to
+125°C
-27
50
mV
LGL Gate Discharge
Resistor
RLGL
EN = 0
400
500
700
Ω
Over-Temperature Protection (OTP)
Rising Thermal Shutdown
OTPR
-
-
-
160
-
°C
Falling Thermal Recovery
OTPF
-
-
-
145
-
°C
Driver Response Time to
Thermal Shutdown
-
Design simulation
-
-
45
-
µs
1. Parameters with MIN and/or MAX limits are 100% tested at -55°C, +25°C, +125°C and at +25°C post radiation.
2. Typical values are not guaranteed.
3. UVLO for PVCC is detected on the FB pin. PVCC UVLO thresholds are set at 96.5% rising and 94% falling, typical at +25°C, of the set
PVCC voltage. PVCC UVLO thresholds production tested only at PVCC set to 5.5V.
Unless otherwise specified: VDD = 13.2V; EN = VDD; PVCC = 5.5V; CPVCC = 2.2µF; CAVCC =2.2µF; CBOOT = 100nF to PHS;
PHS = PGND = 0V; TA= 25°C. UG is defined as UGH = UGL. LG is defined as LGH = LGL. Boldface specifications apply across
the operating temperature range from -55°C to +125°C and across a total ionizing dose of 75krad(Si) at +25°C with exposure
at a low dose rate of <10mrad(Si)/s. (Cont.)
Parameter
Symbol
Test Conditions
Temp.
Min[1]
Typ.[2]
Max[1]
Unit



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