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LM98640QML-SP

SNAS461G – MAY 2010 – REVISED NOVEMBER 2018

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Copyright © 2010–2018, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 7

6.1

Absolute Maximum Ratings ...................................... 7

6.2

ESD Ratings

.................................................... 7

6.3

Recommended Operating Conditions ....................... 7

6.4

Thermal Information

......................... 8

6.5

Quality Conformance Inspection ............................... 8

6.6

LM98640QML-SP Electrical Characteristics ............. 9

6.7

AC Timing Specifications ....................................... 17

6.8

Typical Performance Characteristics ...................... 18

7

Detailed Description ............................................ 20

7.1

Overview ................................................................. 20

7.2

Functional Block Diagram ....................................... 20

7.3

Feature Description................................................. 21

7.4

Device Functional Mode ......................................... 32

7.5

Programming........................................................... 34

7.6

Register Maps ......................................................... 36

8

Application and Implementation ........................ 46

8.1

Application Information............................................ 46

8.2

Typical Application ................................................. 47

8.3

Initialization Set Up ................................................ 47

9

Layout ................................................................... 48

9.1

Layout Guidelines ................................................... 48

10

Device and Documentation Support ................. 49

10.1

Device Support .................................................... 49

10.2

Receiving Notification of Documentation Updates 49

10.3

Community Resources.......................................... 49

10.4

Export Control Notice ............................................ 49

10.5

Trademarks ........................................................... 49

10.6

Electrostatic Discharge Caution ............................ 49

10.7

Glossary ................................................................ 49

11

Mechanical, Packaging, and Orderable

Information ........................................................... 50

11.1

Engineering Samples ............................................ 50

4 Revision History

Changes from Revision F (October 2018) to Revision G

Page

•

Changed pin diagram in Pin Configuration and Functions section to correct typographical error ......................................... 4

Changes from Revision E (December 2017) to Revision F

Page

•

Deleted Operating Life Test Delta Parameters Table ........................................................................................................... 1

•

Updated Features section bullets to include SMD information............................................................................................... 1

•

Updated Applications section ................................................................................................................................................. 1

•

Added new orderable to the Device Information table ........................................................................................................... 1

•

Added engineering samples footnote ..................................................................................................................................... 1

•

Deleted LM98640-MDR and LM9864-MDP from the Device Information table ..................................................................... 1

•

Updated thermal metrics ....................................................................................................................................................... 8

•

Deleted 15 MHz and 25 MHz min/max spec ........................................................................................................................ 11

•

Changed ENOB typical for subgroup 6 at 25 MHz .............................................................................................................. 16

•

Added minimum spec value for ENOB subgroups 4,5 at 40 MHz ...................................................................................... 16

•

Changed pulses to windows................................................................................................................................................. 23

•

Updated wording in CDS Mode CLAMP/SAMPLE Adjust section ...................................................................................... 23

•

Updated wording in Input Bias and Clamping section ......................................................................................................... 24

Changes from Revision D (September 2015) to Revision E

Page

•

Changed 64 Lead to 68 Lead in the Device Information table............................................................................................... 1