AD6673 datasheet(46/46 Pages) AD

46 / 46 page

Data Sheet

AD6673

Rev. C | Page 45 of 45

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

*5.70

5.60 SQ

5.50

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.20

7.10

7.00 SQ

6.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

*COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-2

WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION.

Figure 57. 48-Lead Lead Frame Chip Scale Package [LFCSP]

7 mm × 7 mm Body and 0.75 mm Package Height

(CP-48-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD6673BCPZ-250

−40°C to +85°C

48-Lead Lead Frame Chip Scale Package [LFCSP]

CP-48-13

AD6673BCPZRL7-250

−40°C to +85°C

48-Lead Lead Frame Chip Scale Package [LFCSP]

CP-48-13

AD6673-250EBZ

−40°C to +85°C

Evaluation Board with AD6673-250

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D10632-0-12/15(C)

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