AD6673 datasheet(12/46 Pages) AD

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Data Sheet

AD6673

Rev. C | Page 11 of 45

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

ELECTRICAL

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

DVDD to DGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

RFCLK to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CS, PDWN to AGND

−0.3 V to AVDD + 0.3 V

SCLK to AGND

−0.3 V to AVDD + 0.3 V

SDIO to AGND

−0.3 V to AVDD + 0.3 V

RST to DGND

−0.3 V to DVDD + 0.3 V

FDA, FDB to DGND

−0.3 V to DVDD + 0.3 V

SERDOUT0+, SERDOUT0−,

SERDOUT1+, SERDOUT1− to AGND

−0.3 V to DRVDD + 0.3 V

SYNCINB+, SYNCINB− to DGND

−0.3 V to DVDD + 0.3 V

SYSREF+, SYSREF− to AGND

−0.3 V to AVDD + 0.3 V

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

PackageType

Airflow

Velocity

(m/sec)

1,2

1,3

1,4

Unit

48-Lead LFCSP

7 mm × 7 mm

(CP-48-13)

°C/W

1.0

°C/W

2.5

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD-883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane. As shown in Table 7, airflow increases

heat dissipation, which reduces θJA. In addition, metal in direct

contact with the package leads from metal traces, through holes,

ground, and power planes reduces the θJA.

ESD CAUTION

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