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IS46DR16640C Scheda tecnica(PDF) 44 Page - Integrated Silicon Solution, Inc |
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IS46DR16640C Scheda tecnica(HTML) 44 Page - Integrated Silicon Solution, Inc |
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44 / 49 page ![]() 44 Integrated Silicon Solution, Inc. — www.issi.com Rev. 00A 6/4/2013 IS43/46DR81280C, IS43/46DR16640C PRECHARGE The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row activation a specified time (tRP) after the PRECHARGE command is issued, except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is allowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. After a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. A PRECHARGE command is allowed if there is no open row in that bank (idle state) or if the previously open row is already in the process of precharging. However, the precharge period will be determined by the last PRECHARGE command issued to the bank. REFRESH REFRESH is used during normal operation of the DDR2 SDRAM and is analogous to CAS-before-RAS (CBR) REFRESH. All banks must be in the idle mode prior to issuing a REFRESH command. This command is nonpersistent, so it must be issued each time a refresh is required. The addressing is generated by the internal refresh controller. This makes the address bits a “Don’t Care” during a REFRESH command. SELF REFRESH The SELF REFRESH command can be used to retain data in the DDR2 SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the DDR2 SDRAM retains data without external clocking. All power supply inputs (including VREF) must be maintained at valid levels upon entry/exit and during SELF REFRESH operation. The SELF REFRESH command is initiated like a REFRESH command except CKE is LOW. The DLL is automatically disabled upon entering self refresh and is automatically enabled upon exiting self refresh. ODT (On-Die Termination) The On-Die Termination feature allows the DDR2 SDRAM to easily implement a termination resistance (Rtt) for each DQ, DQS, DQS, RDQS, and RDQS signal. The ODT feature can be configured with the Extended Mode Register Set (EMRS) command, and turned on or off using the ODT input signal. Before and after the EMRS is issued, the ODT input must be received with respect to the timings of tAOFD, tMOD(max), tAOND; and the CKE input must be held HIGH throughout the duration of tMOD(max). The DDR2 SDRAM supports the ODT on and off functionality in Active, Standby, and Power Down modes, but not in Self Refresh mode. ODT timing diagrams follow for Active/Standby mode and Power Down mode. EMRS to ODT Update Delay EMRS CK CK CMD NOP NOP NOP NOP NOP ODT tMOD,max tMOD,min Old setting ODT ReadyUpdated Rtt tAOFD tIS tAOND |
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